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公开(公告)号:US20240359220A1
公开(公告)日:2024-10-31
申请号:US18648197
申请日:2024-04-26
发明人: Shigeru YAMAMOTO , Yasuhiko NAGAI , Keiji IWATA , Takashi AKIYAMA , Akira ITO , Daiki FUJII , Kazuki GODA , Yosuke NISHINO , Yuya KAWAI , Kenji EDAMITSU
CPC分类号: B08B9/027 , H01L21/6715 , B08B2209/027
摘要: Provided is a substrate treating apparatus for treating a substrate. The substrate treating apparatus includes a substrate treating unit configured to supply a water-insoluble water repellent to the substrate to perform water-repellent treatment to the substrate, a decomposition solution mixing mechanism configured to mix a decomposition solution for decomposing the water repellent to a water repellent-containing liquid that contains the water repellent as a waste liquid generated through the water-repellent treatment of the substrate, and a discharging unit configured to discharge a mixed liquid of the water repellent-containing liquid and the decomposition solution to an outside of the substrate treating apparatus.