公开(公告)号：US20220367232A1

公开(公告)日：2022-11-17

申请号：US17686661

申请日：2022-03-04

Applicant: SAULTECH TECHNOLOGY CO., LTD.

Inventor： YEN HAO LU

IPC: H01L21/683 ,  H01L21/82 ,  H01L21/02

Abstract: A hybrid die bonding method includes the following steps: dicing a wafer into a plurality of dies arranged on a plurality of target blocks of a carrier film, wherein surfaces of each of the dies having no solder and bump; cleaning particulate from first surfaces of the dies; separating sides and corners of second surfaces of the dies from the target blocks; turning the carrier film and transferring the dies to a first carrier, wherein the first surfaces of the dies contact the first carrier; removing the carrier film from the second surfaces of the dies; cleaning particulate from the second surfaces of the dies; and transferring the dies from the first carrier to a substrate, wherein a surface of the substrate having no solder and bump. As such, the method reduces the adhesive force between the dies and the carrier film.

公开(公告)号：US20220208722A1

公开(公告)日：2022-06-30

申请号：US17492711

申请日：2021-10-04

Applicant: SAULTECH TECHNOLOGY CO., LTD.

Inventor： YEN HAO LU

IPC: H01L23/00

Abstract: A die bonding method with corner or side contact without impact force includes the steps: picking up a die by a die bonding device, wherein a surface of the die has no solder and bump; moving the die to one side of a die placement area of a substrate, wherein the substrate has no solder and bump; blowing one corner or one side of the die a positive pressure from the die bonding device to bend the corner/side to contact the die placement area; forming a bonding wave after the corner/side of the die contacting the die placement area, and spreading the bonding wave from the corner/side to opposite corner/side of the die, and separating the die from the die bonding device gradually and bonding the die on the die placement area; and bonding the die on the die placement area completely.