公开(公告)号：US20230078220A1

公开(公告)日：2023-03-16

申请号：US18048924

申请日：2022-10-24

申请人： SAMSUNG ELECTRONICS., LTD.

发明人： Hunjae JANG ,  Seungming Shin ,  Kuntack Lee ,  Seungho Kim ,  Younghoo Kim ,  Taehong Kim ,  Sunghyun Park

IPC分类号： H01L21/02 ,  B08B3/08 ,  B08B7/00 ,  B08B3/10

摘要： A wafer-cleaning apparatus includes an inner pin that supports a wafer. The wafer-cleaning apparatus further includes a nozzle disposed above the inner pin, a light source disposed under the inner pin, a window disposed between the light source and the wafer, and a window protector disposed between the wafer and the window. The nozzle supplies a chemical liquid to the wafer and the inner pin distributes a portion of the chemical liquid on an upper surface of the wafer by rotating the wafer. The window protector receives a portion of the chemical liquid that flows out of the wafer and the light source supplies the light to the wafer through the window protector and the window.