公开(公告)号：US20250098355A1

公开(公告)日：2025-03-20

申请号：US18444062

申请日：2024-02-16

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Weizhong ZHOU

IPC: H01L27/146

Abstract: A chip package structure and a method of manufacturing the same are provided. The chip package structure includes a substrate; a chip spaced from the substrate and having a first surface, a second surface and a side surface, the first surface of the chip including a photosensitive area and a non-photosensitive area surrounding the photosensitive area; a molding layer having a first surface and a second surface, the molding layer provided on the non-photosensitive area of the chip and the side surface of the chip.

公开(公告)号：US20250029882A1

公开(公告)日：2025-01-23

申请号：US18754897

申请日：2024-06-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Weizhong ZHOU

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00 ,  H01L23/13

Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes a substrate including first and second surfaces opposite to each other and a groove recessed from the first surface, a chip within the groove and including an active surface facing a bottom surface of the groove, an inactive surface opposite to the active surface, and a side surface connecting the active surface with the inactive surface, chip pads on the active surface of the chip, a shielding layer including a first sub-shielding layer between the bottom surface of the groove and the active surface of the chip and including openings corresponding to the chip pads, respectively, a third sub-shielding layer on the inactive surface of the chip, and a second sub-shielding layer between the side surface of the chip and a side surface of the groove and connecting the first and third sub-shielding layers.