公开(公告)号：US12208541B2

公开(公告)日：2025-01-28

申请号：US17746454

申请日：2022-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngja Kim ,  Hyunggil Baek ,  Younhwan Shin

IPC: B28D5/02 ,  C01B32/25

Abstract: A dicing blade includes: a first blade portion and a second blade portion at least partially surrounding the first blade portion, wherein the first blade portion includes: a first bonding layer; first diamond particles disposed in the first bonding layer and having a first density in the first bonding layer; and first metal particles disposed in the first bonding layer, and wherein the second blade portion includes: a second bonding layer at least partially surrounding the first bonding layer; and second diamond particles disposed in the second bonding layer and having a second density in the second bonding layer, wherein the second density is higher than the first density.

公开(公告)号：US20240091968A1

公开(公告)日：2024-03-21

申请号：US18132169

申请日：2023-04-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Younhwan Shin ,  Dongju Jang

IPC: B26D1/00 ,  B26D1/06

CPC classification number: B26D1/0006 ,  B26D1/065 ,  B26D2001/006

Abstract: A blade for sawing a panel, including a first blade portion configured to saw the panel along a first direction, wherein the panel includes a plurality of panel level packages (PLPs) arranged in the first direction and a second direction which is substantially perpendicular to the first direction; and a second blade portion arranged on an upper surface of the first blade portion, and configured to saw the panel along the second direction, wherein a width of the second blade portion is greater than a width of the first blade portion.