公开(公告)号：US20220320370A1

公开(公告)日：2022-10-06

申请号：US17569028

申请日：2022-01-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngkyu SUNG ,  Dooho JEONG ,  Myunggoo CHEONG ,  Seungwan CHAE

IPC: H01L33/24 ,  H01L27/15 ,  H01L33/60 ,  H01L33/22 ,  H01L33/62 ,  H01L33/42 ,  H01L33/32

Abstract: A semiconductor light emitting device package includes: a substrate; a first semiconductor layer including first regions including a first-type semiconductor material and having a first height, and a second region disposed between the first regions and having a second height lower than the first height; an active layer including disposed in the first regions, and emitting light of a predetermined wavelength band; a second semiconductor layer disposed on the active layer and formed of a second-type semiconductor material; a third semiconductor layer disposed on the second semiconductor layer, and formed of a second-type semiconductor material different from the second-type semiconductor material of the second semiconductor layer; a transparent electrode layer including disposed on the third semiconductor layer; and a reflective electrode layer electrically connected to the transparent electrode layer, respectively, and including portions overlapping the active layer in a vertical direction and a horizontal direction, respectively.