公开(公告)号：US20160204314A1

公开(公告)日：2016-07-14

申请号：US14973996

申请日：2015-12-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun Tae HWANG ,  Il Woo PARK ,  Young Sim O ,  Daseul YU ,  Jae Sung YOU ,  Chang Bun YOON

IPC: H01L33/46 ,  H01L33/48 ,  H01L33/58 ,  H01L33/50 ,  H01L33/38

CPC classification number: H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L2224/16225 ,  H01L2933/0041

Abstract: A light emitting diode (LED) package includes: a package substrate having a first electrode structure and a second electrode structure; an LED chip disposed above a first surface of the package substrate and having a first electrode attached to the first electrode structure and a second electrode attached to the second electrode structure; a reflective layer disposed above the first surface of the package substrate to be separated from the LED chip, having a thickness less than a thickness of the LED chip, and configured to reflect light emitted from the LED chip to a given direction, wherein the wavelength converter has an upper surface substantially parallel to the first surface of the package substrate and a side surface inclined towards the upper surface of the wavelength converter.

Abstract translation: 发光二极管（LED）封装包括：具有第一电极结构和第二电极结构的封装基板; LED芯片，其设置在所述封装基板的第一表面上方，并且具有附接到所述第一电极结构的第一电极和附着到所述第二电极结构的第二电极; 反射层，设置在所述封装基板的与所述LED芯片分离的所述第一表面之上，所述反射层的厚度小于所述LED芯片的厚度，并且被配置为将从所述LED芯片发射的光反射到给定方向，其中所述波长 转换器具有基本上平行于封装衬底的第一表面的上表面和朝向波长转换器的上表面倾斜的侧表面。