公开(公告)号：US09768051B2

公开(公告)日：2017-09-19

申请号：US15071228

申请日：2016-03-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Xinglong Chen ,  Dali Liu ,  Sung-Ho Jang ,  Yong-Ho Lim

IPC: H01L21/687

CPC classification number: H01L21/68728

Abstract: A wafer clamping apparatus, including a plurality of support pins under a wafer, the plurality of pins to support the wafer; and a side clamp at a lateral side of the wafer, the side clamp to directly contact a lateral side of the wafer to press the wafer, the side clamp to press the wafer in a first direction or a second direction, the first direction and the second direction being different directions.