公开(公告)号：US20230377857A1

公开(公告)日：2023-11-23

申请号：US18105918

申请日：2023-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SE JIN OH ,  YEONG KWANG LEE ,  JONG HUN PI ,  JUNG MIN KO ,  DOUG YONG SUNG

IPC: H01J37/32 ,  G01J3/02

CPC classification number: H01J37/32972 ,  G01J3/021 ,  G01J3/0208 ,  G01J3/0291

Abstract: A plasma processing apparatus includes; a housing including a first side wall and a second side wall, wherein the housing defines a processing region in which plasma is generated, an optical source unit disposed on the first side wall in alignment with the viewing window, wherein the optical source unit is configured to irradiate the processing region with incident light through the viewing window, a reflector disposed on the second side wall of the housing, wherein the reflector reflects a portion of the incident light irradiating the processing region to generate reflected light, a spectrometer configured to receive the reflected light from the reflector through the viewing window and the optical source unit and a controller configured to determine density of the active species gas within the processing region in relation to the incident light and the reflected light.