公开(公告)号：US20190130059A1

公开(公告)日：2019-05-02

申请号：US16233422

申请日：2018-12-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JONGWOOK JEON ,  YEOIL YUN ,  SANGWOO PAE ,  UIHUI KWON ,  KEUNHO LEE

IPC: G06F17/50

Abstract: A method of designing a semiconductor circuit using a circuit simulation tool executed by a computer includes calculating power consumptions of elements of the semiconductor circuit by use of the circuit simulation tool. A thermal netlist is created about the semiconductor circuit, based on the power consumptions and geometry information of each of the elements. A simulation of the semiconductor circuit is performed with the thermal netlist using the circuit simulation tool to detect a temperature of each of the elements. The thermal netlist includes thermal capacitance information of each of the elements.

公开(公告)号：US20190294748A1

公开(公告)日：2019-09-26

申请号：US16280205

申请日：2019-02-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JONGWOOK JEON ,  YEOIL YUN ,  SANGWOO PAE ,  UIHUI KWON ,  KEUNHO LEE

IPC: G06F17/50

Abstract: A method of designing a semiconductor circuit using a circuit simulation tool executed by a computer includes calculating power consumptions of elements of the semiconductor circuit by use of the circuit simulation tool. A thermal netlist is created about the semiconductor circuit, based on the power consumptions and geometry information of each of the elements. A simulation of the semiconductor circuit is performed with the thermal netlist using the circuit simulation tool to detect a temperature of each of the elements. The thermal netlist includes thermal capacitance information of each of the elements.