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公开(公告)号：US20250014986A1
公开(公告)日：2025-01-09
申请号：US18748662
申请日：2024-06-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Rui ZHANG , Kyoungsoo Kim , WooPoung Kim
IPC: H01L23/522 , H01L23/00 , H01L23/498 , H01L25/065
Abstract: A semiconductor package comprises a core layer, an integrated stack capacitor (ISC) on the core layer, one or more build-up layers on the core layer in which the ISC is embedded, and one or more metal layers on the core layer.
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