公开(公告)号：US11107841B2

公开(公告)日：2021-08-31

申请号：US16503035

申请日：2019-07-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwoon Jang ,  Wonsoon Park ,  Dongmyung Son ,  Sangmin Shin ,  Changjoon Lee ,  Youngki Jung ,  Seongphil Cho ,  Gyun Heo ,  Soonmin Hong

IPC: H01L27/12 ,  H01L25/16

Abstract: A display panel is provided. The display panel according to an embodiment includes a thin film transistor glass substrate, a plurality of micro light emitting diodes (LEDs) arranged on one surface of the thin film transistor glass substrate, and a plurality of side wirings formed at an edge of the thin film transistor glass substrate to electrically connect the one surface of the thin film transistor glass substrate to an opposite surface to the one surface.

公开(公告)号：US11742358B2

公开(公告)日：2023-08-29

申请号：US17383992

申请日：2021-07-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwoon Jang ,  Wonsoon Park ,  Dongmyung Son ,  Sangmin Shin ,  Changjoon Lee ,  Youngki Jung ,  Seongphil Cho ,  Gyun Heo ,  Soonmin Hong

IPC: H01L27/12 ,  H01L25/16

CPC classification number: H01L27/124 ,  H01L25/167

Abstract: A display panel is provided. The display panel according to an embodiment includes a thin film transistor glass substrate, a plurality of micro light emitting diodes (LEDs) arranged on one surface of the thin film transistor glass substrate, and a plurality of side wirings formed at an edge of the thin film transistor glass substrate to electrically connect the one surface of the thin film transistor glass substrate to an opposite surface to the one surface.

公开(公告)号：US20230103123A1

公开(公告)日：2023-03-30

申请号：US18076985

申请日：2022-12-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjoon LEE ,  Seongho Son ,  Jongsung Lee ,  Wonsoon Park ,  Donghun Lee

IPC: H01L33/38 ,  H01L25/075 ,  H01L33/62

Abstract: A light emitting diode (LED) module includes: a substrate; a plurality of first electrodes arranged on a top surface of the substrate; a second electrode provided on the top surface of the substrate among the plurality of first electrodes; and an LED electrically connected to the plurality of first electrodes.

公开(公告)号：US11362249B2

公开(公告)日：2022-06-14

申请号：US16991133

申请日：2020-08-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu Chung ,  Changjoon Lee ,  Kwangrae Jo ,  Sungyong Min ,  Wonsoon Park ,  Kyungwoon Jang ,  Daesuck Hwang

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/58 ,  H01L33/48 ,  H01L33/00 ,  G09G3/32

Abstract: A method of manufacturing a display module includes forming a driving circuit layer on a substrate, the driving circuit layer including a plurality of driving circuits and a plurality of electrode pads electronically connected with the plurality of driving circuits; forming an adhesive layer on the driving circuit layer; transferring each of a plurality of light emitting diodes (LEDs) onto a respective area of the adhesive layer corresponding to a respective one of the plurality of electrode pads; and forming a black matrix layer on the adhesive layer, between the plurality of LEDs.

公开(公告)号：US20210111324A1

公开(公告)日：2021-04-15

申请号：US16991133

申请日：2020-08-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Changjoon Lee ,  Kwangrae Jo ,  Sungyong Min ,  Wonsoon Park ,  Kyungwoon Jang ,  Daesuck Hwang

IPC: H01L33/62 ,  G09G3/32 ,  H01L27/15 ,  H01L33/58 ,  H01L33/00 ,  H01L33/48

Abstract: A method of manufacturing a display module includes forming a driving circuit layer on a substrate, the driving circuit layer including a plurality of driving circuits and a plurality of electrode pads electronically connected with the plurality of driving circuits; forming an adhesive layer on the driving circuit layer; transferring each of a plurality of light emitting diodes (LEDs) onto a respective area of the adhesive layer corresponding to a respective one of the plurality of electrode pads; and forming a black matrix layer on the adhesive layer, between the plurality of LEDs.