公开(公告)号：US11041097B2

公开(公告)日：2021-06-22

申请号：US16661287

申请日：2019-10-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung-il Park ,  Myeong Hoon Han ,  Sanghyun Park ,  Wonki Hur ,  Seungho Park ,  Hao Cui

IPC: C09G1/02 ,  H01L27/24 ,  H01L45/00

Abstract: A polishing composition and a method of fabricating a semiconductor device using the same, the polishing composition including an abrasive; a first additive that includes a C5 to C30 hydrocarbon including an amide group and a carboxyl group or a C5 to C30 hydrocarbon including two or more amine groups; and a second additive that includes a sulfonic acid, a sulfonate, or a sulfonate salt.