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1.发明申请公开(公告)号：US20250041996A1
公开(公告)日：2025-02-06
申请号：US18425770
申请日：2024-01-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Wonkeun Cho , Donghoon Kwon
Abstract: Disclosed are grinding wheels, back-grinding apparatuses, and abrasive article manufacturing methods. The grinding wheel comprises a wheel body having a disk shape and an abrasive article combined with one surface of the wheel body. The abrasive article includes an abrasive body and a plurality of grinding particles in the abrasive body. The abrasive body provides a groove hole that is recessed in a first direction as a horizontal direction on a lateral surface of the abrasive body. A length in the first direction of the groove hole is less than a width in the first direction of the abrasive body.
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