公开(公告)号：US10025888B2

公开(公告)日：2018-07-17

申请号：US14153661

申请日：2014-01-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ui-Hui Kwon ,  Vasily Zabelin ,  Sachio Nagura ,  Keun-Ho Lee

IPC: G06F17/50

Abstract: A system for simulating a semiconductor device comprises a data input module configured to receive structural data of the semiconductor device comprising a first region and a second region, and a spatial discretization generating module configured to divide a space of the semiconductor device using the structural data through division of the first region into first type meshes and division of the second region into second type meshes different from the first type meshes.