公开(公告)号：US10109617B2

公开(公告)日：2018-10-23

申请号：US15652559

申请日：2017-07-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang-Ryul Lee ,  Boseong Kim ,  Taeduk Nam ,  Wangju Lee

IPC: H01L23/552 ,  H01L25/18 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H01L23/00

Abstract: A solid state drive package is provided. The solid state drive package may include an integrated circuit substrate including: a lower redistribution layer; a first chip and a second chip provided on the lower redistribution layer; and a connection substrate provided on the lower redistribution layer, the connection substrate provided on an outer periphery of the first chip and the second chip; and a plurality of third chips provided on the integrated circuit substrate. The plurality of third chips are electrically connected to the first chip and the second chip via the connection substrate and the lower redistribution layer.

公开(公告)号：US12229442B2

公开(公告)日：2025-02-18

申请号：US17708771

申请日：2022-03-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngwoo Park ,  Taeduk Nam

IPC: G06F3/06

Abstract: A storage device, including a printed circuit board including a connector including a plurality of pins capable of being coupled to an external host device, a controller socket, a first slot, a second slot, a third slot, and a fourth slot; a first universal flash storage (UFS) device, a second UFS device, a third UFS device, and a fourth UFS device, wherein each UFS device of the first to fourth UFS devices is removably installed in a corresponding slot of the first to fourth slots; and a storage controller mounted in the controller socket, and configured to control the first to fourth UFS devices, wherein the first UFS device and the second UFS device are configured to communicate with the storage controller through a first channel, and the third UFS device and the fourth UFS device are configured to communicate with the storage controller through a second channel.