公开(公告)号：US20230007903A1

公开(公告)日：2023-01-12

申请号：US17708771

申请日：2022-03-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngwoo PARK ,  Taeduk NAM

IPC: G06F3/06

Abstract: A storage device, including a printed circuit board including a connector including a plurality of pins capable of being coupled to an external host device, a controller socket, a first slot, a second slot, a third slot, and a fourth slot; a first universal flash storage (UFS) device, a second UFS device, a third UFS device, and a fourth UFS device, wherein each UFS device of the first to fourth UFS devices is removably installed in a corresponding slot of the first to fourth slots; and a storage controller mounted in the controller socket, and configured to control the first to fourth UFS devices, wherein the first UFS device and the second UFS device are configured to communicate with the storage controller through a first channel, and the third UFS device and the fourth UFS device are configured to communicate with the storage controller through a second channel

公开(公告)号：US20230011160A1

公开(公告)日：2023-01-12

申请号：US17729060

申请日：2022-04-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Song-Soo KIM ,  Taeduk NAM

IPC: H01L25/065

Abstract: A semiconductor package includes first semiconductor chips stacked on a package substrate, a lowermost first semiconductor chip of the first semiconductor chips including a recessed region, and a second semiconductor chip inserted in the recessed region, the second semiconductor chip being connected to the package substrate.