公开(公告)号：US10163741B2

公开(公告)日：2018-12-25

申请号：US15677053

申请日：2017-08-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-Ho Kim ,  Ho-Sung Song ,  Jeong-Sik Nam ,  Kyoung-Min Kim ,  Tae-Hyeong Lee

IPC: G01R31/28 ,  H01L21/66 ,  H01L21/78 ,  H01L23/544

Abstract: A semiconductor device structure, including integrated circuits of semiconductor chips and scribe lanes between the regions in which the circuits have been formed, has at least one redistribution pad disposed in one of the scribe lanes for simultaneously testing a group of the integrated circuits, and a metal interconnection structure disposed beneath the redistribution pad(s). The metal interconnection structure includes at least conductive via contacting the redistribution pad at the bottom of the pad. The conductive via(s) is/are arranged so that at least a portion of each via remains attached to the redistribution pad when the structure is sawed along the scribe lane.