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公开(公告)号:US20200272210A1
公开(公告)日:2020-08-27
申请号:US16872896
申请日:2020-05-12
Applicant: SAMSUNG ELECTRONICS co., LTD.
Inventor: Jiyong KIM , Suin KIM , Teck Su OH , Sung-Ki LEE
Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.
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公开(公告)号:US20210294392A1
公开(公告)日:2021-09-23
申请号:US17338835
申请日:2021-06-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jiyong KIM , Suin KIM , Teck Su OH , Sung-Ki LEE
Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.
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公开(公告)号:US20190354145A1
公开(公告)日:2019-11-21
申请号:US16260278
申请日:2019-01-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jiyong KIM , Suin KIM , Teck Su OH , Sung-Ki LEE
Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.
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