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公开(公告)号：US10658326B2
公开(公告)日：2020-05-19
申请号：US15616525
申请日：2017-06-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Won-Gil Han , Sangho An , Yong Je Lee , Jae Heung Lee , Seungweon Ha
IPC: H01L23/00 , H01L25/065
Abstract: A bonding wire includes a wire core including a silver-palladium alloy. A coating layer is disposed on a sidewall of the wire core. A palladium content of the silver-palladium alloy ranges from about 0.1 wt % to about 1.5 wt %.
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