公开(公告)号：US20180174869A1

公开(公告)日：2018-06-21

申请号：US15652345

申请日：2017-07-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SEONG-MOON HA ,  Min-Kyu SUNG ,  Seung-Hee CHO ,  Seong-Chul CHOI ,  Kyung-Sun KIM ,  Sang-Ho LEE

IPC: H01L21/67 ,  H01J37/32

Abstract: A temperature controller of a plasma-processing apparatus including a heating unit and a cooling unit. The heating unit is configured to heat a liner on an inner surface of a plasma chamber in which a plasma is formed. The cooling unit is configured to cool the liner to controls a temperature of an upper electrode in the plasma chamber.