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公开(公告)号:US12219721B2
公开(公告)日:2025-02-04
申请号:US18529889
申请日:2023-12-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
IPC: H05K5/02 , H01R12/70 , H01R12/72 , H01R12/73 , H01R13/621 , H05K5/00 , H05K7/20 , H01L25/18 , H05K1/11 , H05K1/18
Abstract: A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.
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公开(公告)号:USD988318S1
公开(公告)日:2023-06-06
申请号:US29805535
申请日:2021-08-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is another perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.-
公开(公告)号:US11889643B2
公开(公告)日:2024-01-30
申请号:US17329900
申请日:2021-05-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Han Hong Lee , Jae Hong Park , Seon Gyun Baek , Yusuf Cinar
CPC classification number: H05K5/0221 , H05K5/0008 , H05K5/023
Abstract: An extension kit includes a case, a locking lever, and a first elastic member. The case has an interior space which extends in a first direction. The locking lever includes a lever portion which is rotatable about a first rotation axis extending in a second direction intersecting the first direction, a plate portion which extends from the lever portion and which is exposed at the case, an arm portion which extends in the second direction from the plate portion, and a first locking portion which protrudes from the arm portion. The first elastic member is provided in the interior space of the case and elastically connects the case and the locking lever in the interior space of the case.
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公开(公告)号:USD987640S1
公开(公告)日:2023-05-30
申请号:US29837307
申请日:2022-05-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Yusuf Cinar , Han Hong Lee , Seon Gyun Baek
Abstract: FIG. 1 is a front perspective view of an extension kit for storage device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a rear perspective view thereof.
The evenly dashed broken lines in the figures depict features of the extension kit for storage device that form no part of the claimed design.-
公开(公告)号:US11877410B2
公开(公告)日:2024-01-16
申请号:US17217759
申请日:2021-03-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
IPC: H05K5/02 , H01R12/70 , H01R12/72 , H01R12/73 , H01R13/621 , H05K5/00 , H05K7/20 , H01L25/18 , H05K1/11 , H05K1/18
CPC classification number: H05K5/0217 , H01R12/7023 , H01R12/721 , H01R12/73 , H01R13/621 , H05K5/0008 , H05K5/026 , H05K7/20409 , H01L25/18 , H05K1/117 , H05K1/181 , H05K7/20445 , H05K2201/09063 , H05K2201/10159
Abstract: A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.
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公开(公告)号:USD997939S1
公开(公告)日:2023-09-05
申请号:US29805536
申请日:2021-08-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a left-side view thereof; and,
FIG. 4 is a top plan view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.-
公开(公告)号:USD998612S1
公开(公告)日:2023-09-12
申请号:US29805549
申请日:2021-08-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing my new design;
FIG. 2 is a front view thereof; and,
FIG. 3 is a top plan view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.-
公开(公告)号:USD997161S1
公开(公告)日:2023-08-29
申请号:US29805545
申请日:2021-08-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing my new design;
FIG. 2 is a front view thereof; and,
FIG. 3 is a top plan view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.-
公开(公告)号:USD986900S1
公开(公告)日:2023-05-23
申请号:US29805770
申请日:2021-08-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a bottom perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.-
公开(公告)号:US11495907B2
公开(公告)日:2022-11-08
申请号:US16822872
申请日:2020-03-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seon Gyun Baek , Jae Hong Park , Yusuf Cinar , Han Hong Lee
IPC: H01R13/50 , H01R13/405 , H01R13/6581 , H01R13/6585 , H01R13/6583 , H01R13/6587 , H01R24/60 , H01R13/6582
Abstract: Provided are a receptacle connector configured to avoid damage to conductors of the receptacle connector. The receptacle connector includes a plurality of connection terminals, a mold structure which comprises a front part exposing each of the connection terminals and a support part disposed on a rear end of the front part and surrounding each of the connection terminals, and a shield which is disposed on the support part and comprises a conductive material, wherein the support part comprises a flat part which includes a surface along which the shield extends and a protruding part which protrudes from the surface of the flat part and is disposed in front of a front end of the shield. The protruding part is configured to avoid damage to conductors of the receptacle when a plug is mated to the receptacle.
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