公开(公告)号：US11757076B2

公开(公告)日：2023-09-12

申请号：US17986009

申请日：2022-11-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chigoo Kang ,  Seogho Lim ,  Ilseop Won ,  Jungwoo Lee

IPC: H01L33/58 ,  H01L27/15 ,  H01L33/62 ,  H01L33/48 ,  H01L33/60 ,  H01L33/38 ,  H01L33/10 ,  G02F1/13357 ,  H01L27/146 ,  F21V5/04 ,  G02B19/00

CPC classification number: H01L33/58 ,  F21V5/04 ,  G02B19/0014 ,  G02B19/0066 ,  G02F1/133606 ,  H01L27/14627 ,  H01L27/156 ,  H01L33/10 ,  H01L33/387 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0058

Abstract: A light source module includes a circuit board, light emitting diode chips on an upper surface of the circuit board, the light emitting diode chips being spaced apart and each emitting blue light and having a first surface facing the upper surface of the circuit board, a second surface opposite the first surface, and first and second electrodes on the first surface, a first multilayer reflective structure on the second surface and including a plurality of alternately stacked insulating layers having different refractive indices, and a lens respectively covering each of the light emitting diode chips and contacting the upper surface of the circuit board at an acute contact angle, the lens having a thickness of 2.5 mm or less from the upper surface of the circuit board, and a contact region with the upper surface of the circuit board with a diameter of 1 mm to 3 mm.

公开(公告)号：US11650458B2

公开(公告)日：2023-05-16

申请号：US17077302

申请日：2020-10-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongsoo Lee ,  Seogho Lim ,  Changho Shin ,  Jongpil Won ,  Sangsu Lee

IPC: H01L25/075 ,  H01L33/60 ,  G02F1/13357 ,  H05K1/02 ,  H05K1/18 ,  G02F1/1335

CPC classification number: G02F1/133611 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  H01L25/0753 ,  H01L33/60 ,  H05K1/0274 ,  G02F1/133607 ,  H05K1/181 ,  H05K2201/10106

Abstract: A light emitting device includes a printed circuit board (PCB) substrate, a first ink layer covering the PCB substrate, the first ink layer having a first refractive index, light emitters on the first ink layer, and a second ink layer on the first ink layer and spaced apart from the light emitters, the second ink layer having a second refractive index different from the first refractive index.

公开(公告)号：US11502229B2

公开(公告)日：2022-11-15

申请号：US17060215

申请日：2020-10-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chigoo Kang ,  Seogho Lim ,  Ilseop Won ,  Jungwoo Lee

IPC: H01L33/58 ,  H01L27/15 ,  H01L33/62 ,  H01L33/48 ,  H01L33/60 ,  H01L33/38 ,  H01L33/10 ,  G02F1/13357 ,  H01L27/146 ,  F21V5/04 ,  G02B19/00

Abstract: A light source module includes a circuit board, light emitting diode chips on an upper surface of the circuit board, the light emitting diode chips being spaced apart and each emitting blue light and having a first surface facing the upper surface of the circuit board, a second surface opposite the first surface, and first and second electrodes on the first surface, a first multilayer reflective structure on the second surface and including a plurality of alternately stacked insulating layers having different refractive indices, and a lens respectively covering each of the light emitting diode chips and contacting the upper surface of the circuit board at an acute contact angle, the lens having a thickness of 2.5 mm or less from the upper surface of the circuit board, and a contact region with the upper surface of the circuit board with a diameter of 1 mm to 3 mm.