公开(公告)号：US10903177B2

公开(公告)日：2021-01-26

申请号：US16511825

申请日：2019-07-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Se-Jin Yoo ,  Hong-Sub Joo ,  Won-Gil Han

IPC: H01L21/00 ,  H01L25/00 ,  H01L23/00 ,  H01L23/60 ,  H01L21/56 ,  H01L25/18 ,  H01L23/31

Abstract: In a method of manufacturing a semiconductor package, a first semiconductor device is arranged on a package substrate. An electrostatic discharge structure is formed on at least one ground substrate pad exposed from an upper surface of the package substrate. A plurality of second semiconductor devices is stacked on the package substrate and spaced apart from the first semiconductor device, the electrostatic discharge structure being interposed between the first semiconductor device and the plurality of second semiconductor devices. A molding member is formed on the package substrate to cover the first semiconductor device and the plurality of second semiconductor devices.

公开(公告)号：US09767569B2

公开(公告)日：2017-09-19

申请号：US14853217

申请日：2015-09-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun-hee Jo ,  Praveen Gulaka ,  Yang-lim Choi ,  Se-Jin Yoo

IPC: G06T7/00 ,  G06T7/11 ,  G06T7/174

CPC classification number: G06T7/174 ,  G06T7/0012 ,  G06T7/11 ,  G06T2207/10088 ,  G06T2207/20116 ,  G06T2207/30048

Abstract: Disclosed are a method for processing a magnetic resonance (MR) image of a dynamic object and an MRI apparatus. The method includes receiving, from the dynamic object, a plurality of MR signals that correspond to a plurality of time sections and a plurality of slices, generating a plurality of MR images by using the plurality of MR signals, performing segmentation of each of the plurality of MR images into a plurality of regions, determining whether a segmentation error occurs in each of the plurality of MR images, and arranging the plurality of MR images to correspond to the respective time sections and the respective slices to display a matrix image, based on a result of the determining.

公开(公告)号：US11594500B2

公开(公告)日：2023-02-28

申请号：US17132880

申请日：2020-12-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Se-Jin Yoo ,  Hong-Sub Joo ,  Won-Gil Han

IPC: H01L23/00 ,  H01L25/00 ,  H01L23/60 ,  H01L21/56 ,  H01L25/18 ,  H01L23/31

Abstract: In a method of manufacturing a semiconductor package, a first semiconductor device is arranged on a package substrate. An electrostatic discharge structure is formed on at least one ground substrate pad exposed from an upper surface of the package substrate. A plurality of second semiconductor devices is stacked on the package substrate and spaced apart from the first semiconductor device, the electrostatic discharge structure being interposed between the first semiconductor device and the plurality of second semiconductor devices. A molding member is formed on the package substrate to cover the first semiconductor device and the plurality of second semiconductor devices.

公开(公告)号：US10185805B2

公开(公告)日：2019-01-22

申请号：US14791564

申请日：2015-07-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Praveen Gulaka ,  Hyun-hee Jo ,  Se-Jin Yoo ,  Jae-moon Jo

IPC: G06F19/00 ,  G06F3/0481 ,  G06F3/0482 ,  G06F3/0484

Abstract: A medical image processing apparatus and method are provided. The medical image processing apparatus includes a controller configured to acquire an icon based on information in a medical image file of an object, the icon having a shape of the object and comprising one or more sub-icons, and a display configured to display the icon. Each of the one or more sub-icons corresponds to an anatomical region of the object is configured to accept input to perform one or more image processing functions associated with the corresponding anatomical region.