Display apparatus and manufacturing method for the same

    公开(公告)号:US11423826B2

    公开(公告)日:2022-08-23

    申请号:US16159077

    申请日:2018-10-12

    Abstract: A display apparatus and a manufacturing method thereof including a plurality of light emitting diode (LED) elements, signal electrodes configured to supply data signals to the plurality of LED elements, and a common electrode configured to provide a ground to the plurality of LED elements, in which one end of each of the plurality signal electrodes is surrounded by the common electrode or respective ends of the common electrode are surrounded by the plurality of signal electrodes.

    Protocol processing method and apparatus for multi-SIM terminal

    公开(公告)号:USRE50215E1

    公开(公告)日:2024-11-19

    申请号:US17178560

    申请日:2021-02-18

    Inventor: Sang Min Shin

    Abstract: A protocol processing method and apparatus are disclosed for a multi-SIM terminal holding multiple subscriber identification cards. The method includes: determining whether all the subscriber identification cards are associated with the same base station (e.g., a Public Land Mobile Network); and conducting, when all the subscriber identification cards are associated with the same base station, frequency scanning and measurement for a selected one of the subscriber identification cards, and sharing the results of frequency scanning and measurement with all the subscriber identification cards. Hence, the multi-SIM terminal may reduce battery power consumption without repeated frequency scanning and measurement for multiple subscriber identification cards.

    Display apparatus and manufacturing method thereof

    公开(公告)号:US11257979B2

    公开(公告)日:2022-02-22

    申请号:US16763079

    申请日:2018-11-09

    Abstract: The present disclosure relates to a display apparatus including a substrate, a thin film transistor disposed on the substrate, a first insulating layer disposed on a source electrode and a drain electrode of the thin film transistor, a light emitting diode disposed on the first insulating layer to emit light toward the substrate, a second insulating layer disposed on the first insulating layer to surround the light emitting diode, an upper electrode disposed on the second insulating layer, and a driver IC chip disposed above the upper electrode to be connected to the upper electrode. According to the above configuration, the driver IC chip is disposed on the back side of a light emitting surface of a display panel, so that a bezel is capable of being minimized or omitted, and manufacturing of the display apparatus is easy and manufacturing costs is reduced.

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