公开(公告)号：US20200075450A1

公开(公告)日：2020-03-05

申请号：US16460679

申请日：2019-07-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ho Sung CHO ,  Sang Kweon LEE ,  Sang Young KIM

IPC: H01L23/31 ,  H01L21/78 ,  H01L23/00

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, an insulating film, and a photo sensitive film. The substrate includes a semiconductor chip region and a scribe line region disposed along an edge of the semiconductor chip region. The insulating film includes a first portion disposed on the semiconductor chip region, a second portion disposed on the scribe line region and connected with the first portion, and a third portion disposed on the scribe line region and protruded in a first direction from the second portion. The photo sensitive film is disposed on the insulating film and has a sidewall exposed on the second portion of the insulating film. A first width of the third portion in a second direction perpendicular to the first direction decreases as a distance from the semiconductor chip region increases.