公开(公告)号：US20240258239A1

公开(公告)日：2024-08-01

申请号：US18427795

申请日：2024-01-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SANGBONG LEE ,  Seowoo Nam ,  SUNGHO SEO ,  SEOKMYEONG KANG ,  KyuHoon Choi ,  SEUNGSEOK HA

IPC: H01L23/535 ,  H01L21/768

CPC classification number: H01L23/535 ,  H01L21/76805 ,  H01L21/76832 ,  H01L21/76895

Abstract: A semiconductor device includes: a first interlayer insulating layer disposed on a substrate; a first conductive line disposed in the first interlayer insulating layer and having a protrusion protruding above an upper side of the first interlayer insulating layer; an etch stop layer disposed on the first interlayer insulating layer and the first conductive line; and a via passing through the etch stop layer and contacting the first conductive line, wherein the etch stop layer includes a first etch stop layer having a curved shape in a cross-sectional view and a second etch stop layer disposed on the first etch stop layer and having a thickness variation.

公开(公告)号：US20220113895A1

公开(公告)日：2022-04-14

申请号：US17234981

申请日：2021-04-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SEONGYONG JANG ,  SUNGHO SEO ,  MYUNGSUB SHIN ,  KYUNGPHIL YOO ,  YOUNGMIN LEE ,  HAESUNG JUNG

IPC: G06F3/06

Abstract: A memory system includes a memory device. A buffer memory is configured to store at least one of a ready-to-transfer (RTT) UFS-Protocol-Information-Unit (UPIU) and a response UPIU. The buffer memory is implemented separately from the memory device. A memory controller is configured to acquire read data from the memory device in response to a read request received from an external host and transmit a read data packet including the read data to the external host. When the at least one of the ready-to-transfer UPIU and the response UPIU stored in the buffer memory is present, the memory controller sends the at least one of the ready-to-transfer UPIU and the response UPIU to the external host, before a transmission of the read data packet is completed.

公开(公告)号：US20180024962A1

公开(公告)日：2018-01-25

申请号：US15647558

申请日：2017-07-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOUNGMIN LEE ,  SUNGHO SEO ,  HYUNTAE PARK ,  HWASEOK OH

IPC: G06F13/42 ,  G06F3/06 ,  H04L29/06

CPC classification number: G06F13/4286 ,  G06F3/061 ,  G06F3/0632 ,  G06F3/0655 ,  G06F3/0679 ,  H04L69/08 ,  H04L69/323 ,  H04L69/329

Abstract: A device includes a first input/output (I/O) port for communication with an external processor, a second I/O port for communication with a second device, and an interface adaptor supporting communication through the first and second I/O ports via a protocol having a plurality of layers, including an application layer, a physical layer, and a physical adaptor layer. The application layer processes information according to an application layer format and the physical adaptor layer processes information according to a physical adaptor layer format. The device receives from the external processor through the first I/O port a request in the application layer format that one or more communication conditions be set for a physical layer of the second device, converts the request from the application layer format to the physical adaptor layer format, and sends the converted request in the physical adaptor layer format to the second device through the second I/O port.