公开(公告)号：US20240321673A1

公开(公告)日：2024-09-26

申请号：US18379286

申请日：2023-10-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunggu KANG ,  JAE CHOON KIM ,  SUNG-HO Mun ,  Hwanjoo Park

IPC: H01L23/367 ,  H01L21/56 ,  H01L23/00 ,  H01L23/373 ,  H01L23/498

CPC classification number: H01L23/3675 ,  H01L21/565 ,  H01L23/3737 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32146 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/182

Abstract: A semiconductor package includes a redistribution layer structure, a semiconductor structure on the redistribution layer structure, at least one heat dissipation structure on the semiconductor structure, where the at least one heat dissipation structure may include a first epoxy molding compound, a molding material for molding the semiconductor structure and the at least one heat dissipation structure, on the redistribution layer structure, where the molding material may include a second epoxy molding compound, where the first epoxy molding compound may have higher thermal conductivity than the second epoxy molding compound.