公开(公告)号：US20230273515A1

公开(公告)日：2023-08-31

申请号：US17933769

申请日：2022-09-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： MUN JA KIM ,  JI BEOM YOO ,  KI BONG NAM ,  JIN HO YEO ,  CHANGYOUNG JEONG ,  QICHENG HU

IPC: G03F1/62 ,  G03F7/20

CPC classification number: G03F1/62 ,  G03F7/70983

Abstract: A method of fabricating a pellicle structure includes forming a metal layer on a temporary substrate, forming a membrane on the metal layer, exposing a bottom surface of the metal layer by separating the temporary substrate from the metal layer, and exposing a bottom surface of the membrane by etching the exposed bottom surface of the metal layer.