公开(公告)号：US12266742B2

公开(公告)日：2025-04-01

申请号：US17724758

申请日：2022-04-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myoungsun Ha ,  Hyunju Park ,  Sunwoo Kim ,  Youngkyung Kim

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/50 ,  H01L33/62

Abstract: A semiconductor light emitting device includes a package body including a concave portion surrounded by sidewalls, a light emitting diode (LED) chip on a mounting surface of the concave portion, a lead frame in the package body and electrically connected to the LED chip, a wavelength conversion layer in the concave portion and surrounding the LED chip, the wavelength conversion layer being surrounded by the sidewalls of the package body and including a wavelength conversion material, and a transparent resin layer on the wavelength conversion layer, the transparent resin layer having first opposite side surfaces exposed through sides of the package body and spaced apart from each other along a first direction parallel to the mounting surface, and second opposite side surfaces contacting an inner surface of the package body and spaced apart from each other in a second direction parallel to the mounting surface.

公开(公告)号：US11195822B2

公开(公告)日：2021-12-07

申请号：US16862648

申请日：2020-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In Joon Pyeon ,  Changhoon Kwak ,  Moonsub Kim ,  Sangsu Kim ,  Myoungsun Ha

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/54

Abstract: A light-emitting package including a substrate having pixel regions; first to third light-emitting chips on each of the pixel regions; and a molding layer on a top surface of the substrate, the molding layer covering the first to third light-emitting chips, wherein one of the first to third light-emitting chips emits light whose color is different from others of the first to third light-emitting chips, on pixel regions, the first to third light-emitting chips are arranged along a first direction, the first direction being parallel to the top surface of the substrate, a minimum interval between the first light-emitting chip and a top or side surface of the molding layer is different from a minimum interval between the second light-emitting chip and the top or side surface of the molding layer, the side surface of the molding layer intersects a second direction parallel to the top surface of the substrate.

公开(公告)号：US20210066260A1

公开(公告)日：2021-03-04

申请号：US16862648

申请日：2020-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In Joon Pyeon ,  Changhoon Kwak ,  Moonsub Kim ,  Sangsu Kim ,  Myoungsun Ha

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/62

Abstract: A light-emitting package including a substrate having pixel regions; first to third light-emitting chips on each of the pixel regions; and a molding layer on a top surface of the substrate, the molding layer covering the first to third light-emitting chips, wherein one of the first to third light-emitting chips emits light whose color is different from others of the first to third light-emitting chips, on pixel regions, the first to third light-emitting chips are arranged along a first direction, the first direction being parallel to the top surface of the substrate, a minimum interval between the first light-emitting chip and a top or side surface of the molding layer is different from a minimum interval between the second light-emitting chip and the top or side surface of the molding layer, the side surface of the molding layer intersects a second direction parallel to the top surface of the substrate.