公开(公告)号：US20190280162A1

公开(公告)日：2019-09-12

申请号：US16129021

申请日：2018-09-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-kuk LEE ,  Moon-sub KIM ,  Sung-jin AHN ,  Suk-ho YOON ,  Seung-hwan LEE

IPC: H01L33/50 ,  H01L33/12 ,  H01L33/26

Abstract: A light-emitting diode (LED) package includes: an LED having a polygonal shape in a plan view; a light-transmissive layer directing light from the LED in an upward direction; a wavelength conversion layer changing a wavelength of the light emitted through the light-transmissive layer; and a coating layer covering the light-transmissive layer and reflecting the light emitted through the light-transmissive layer in the upward direction. In a plan view of the light-transmissive layer, a length from a first point corresponding to a vertex of the LED to a second point corresponding to an end of an extension of a diagonal of the LED is greater than or equal to a length from the first point to a third point corresponding to an end of an extension of a side of the LED.