公开(公告)号：US20220085025A1

公开(公告)日：2022-03-17

申请号：US17225601

申请日：2021-04-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunseok LIM ,  Minhyuk CHO ,  Kyung-Eun BYUN ,  Hyeonjin SHIN ,  Kaoru YAMAMOTO ,  Jungsoo YOON ,  Soyoung LEE ,  Geuno JEONG

IPC: H01L27/108

Abstract: A wiring structure includes a first conductive pattern including doped polysilicon on a substrate, an ohmic contact pattern including a metal silicide on the first conductive pattern, an oxidation prevention pattern including a metal silicon nitride on the ohmic contact pattern, a diffusion barrier including graphene on the oxidation prevention pattern, and a second conductive pattern including a metal on the diffusion barrier.