公开(公告)号：US20220059596A1

公开(公告)日：2022-02-24

申请号：US17315321

申请日：2021-05-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： MINHO JANG ,  KYOUNGWON NA ,  SEUNGKUK KANG ,  HYUNCHUL KIM ,  HYUN YOUNG YEO ,  IN SUNG JOE

IPC: H01L27/146

Abstract: An image sensor includes a first chip that includes a pixel region and a pad region, and a second chip that is in contact with one surface of the first chip and includes circuits that drive the first chip. The first chip includes a first substrate, an interlayer insulating layer disposed between the first substrate and the second chip, first interconnection lines disposed in the interlayer insulating layer, a conductive pad disposed in the pad region between the second chip and the first interconnection lines, and a recess region formed in the pad region that penetrates the first substrate and the interlayer insulating layer and exposes the conductive pad.

公开(公告)号：US20230030489A1

公开(公告)日：2023-02-02

申请号：US17655576

申请日：2022-03-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： MINHO JANG ,  Jeongsoon Kang ,  Donghyun Kim ,  Seungkuk Kang ,  Insung Joe

IPC: H01L27/146

Abstract: An image sensor includes a first structure, a second structure, and a third structure that are sequentially stacked in a vertical direction. The first structure includes a first substrate and at least one first transistor disposed on the first substrate. The second structure includes a second substrate and at least one second transistor disposed on the second substrate. The third structure includes a third substrate that includes an upper surface on which light is incident and a lower surface that is opposite to the upper surface, a photoelectric conversion region disposed in the third substrate, a transfer gate disposed on the lower surface of the third substrate, and a reflective structure disposed on the lower surface of the third substrate and on a lower surface and side surface of the transfer gate.

公开(公告)号：US20240072091A1

公开(公告)日：2024-02-29

申请号：US18203677

申请日：2023-05-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： MINHO JANG ,  DOOWON KWON ,  DOYEON KIM ,  KYUNGTAE LIM

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14634 ,  H01L24/08 ,  H01L24/80 ,  H01L27/14636 ,  H01L27/1469 ,  H04N25/77

Abstract: An image sensor includes a lower substrate having a first surface and a second surface opposing the first surface, lower circuit devices disposed on the first surface, a lower wiring structure electrically connected to the lower circuit devices on the first surface, a lower bonding pad on the second surface, a lower bonding via penetrating through the lower substrate between the lower bonding pad and the lower wiring structure, a landing structure disposed on the first surface and contacting the lower bonding via, an upper bonding pad bonded to the lower bonding pad on the lower bonding pad, and an upper substrate disposed on the upper bonding pad and including photoelectric conversion devices. At least a portion of the landing structure horizontally overlaps the lower circuit devices.

公开(公告)号：US20210134869A1

公开(公告)日：2021-05-06

申请号：US16900076

申请日：2020-06-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： MINHO JANG ,  JEONGSOON KANG ,  TAEHYOUNG KIM ,  MASARU ISHII ,  IN SUNG JOE

IPC: H01L27/146

Abstract: An image sensor includes a substrate having a first surface, a charge storage portion disposed in the substrate, a light-blocking pattern disposed on the first surface overlapping the charge storage portion, and a low-refractive index pattern on the light-blocking pattern.