公开(公告)号：US20170178868A1

公开(公告)日：2017-06-22

申请号：US15248326

申请日：2016-08-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seong Moon HA ,  Kyung Sun KIM ,  Kang Min JEON

IPC: H01J37/32

CPC classification number: H01J37/32532 ,  H01J37/3244 ,  H01J37/3255 ,  H01J37/32568 ,  H01J2237/334

Abstract: An upper electrode for a plasma processing apparatus includes a body portion having a plurality of through-holes, a showerhead disposed below the body portion and having a plurality of jet holes connected to the plurality of through-holes, and a buffer layer interposed between the body portion and the showerhead.

公开(公告)号：US20180182647A1

公开(公告)日：2018-06-28

申请号：US15672623

申请日：2017-08-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Jin NOH ,  Kyung Sun KIM ,  Seung Bo SHIM ,  Yong Woo LEE ,  Ji Soo IM ,  Won Young CHOI

IPC: H01L21/67 ,  C23C16/458 ,  H01J37/32

CPC classification number: H01L21/67069 ,  C23C16/4585 ,  C23C16/5096 ,  H01J37/32642 ,  H01J37/32724 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6831 ,  H01L21/68735

Abstract: A plasma processing apparatus including an electrostatic chuck supporting a wafer; a focus ring disposed to surround an outer circumferential surface of the wafer; an insulation ring disposed to surround an outer circumferential surface of the focus ring; and an edge ring supporting lower portions of the focus ring and the insulation ring, the edge ring being spaced apart from the electrostatic chuck and surrounding an outer circumferential surface of the electrostatic chuck; wherein the edge ring includes a flow channel containing a fluid therein.