公开(公告)号：US10091577B2

公开(公告)日：2018-10-02

申请号：US15507898

申请日：2015-07-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min Kyu Park ,  Kyung Su Kang ,  Se Ki Jang ,  Woo Sung In ,  Ji Hee Kim ,  Jeong Hoon Park

IPC: H04R1/34 ,  H04R3/12 ,  H04R5/02 ,  H04R1/02 ,  H04R1/40

Abstract: An audio device having an improved bendable structure is disclosed. The audio device includes an amplifier unit configured to amplify an audio signal, at least one speaker unit configured to output the amplified audio signal as a sound signal, and at least one link unit rotatably connecting the at least one speaker unit to the amplifier unit.