公开(公告)号：US20240395845A1

公开(公告)日：2024-11-28

申请号：US18796684

申请日：2024-08-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-Chul LEE ,  Beomsuk LEE ,  Minho JANG ,  Kwansik CHO

IPC: H01L27/146

Abstract: An image sensor includes a first chip including a pixel region, a pad region, and an optical black region interposed between the pixel region and the pad region, and a second chip being in contact with a first surface of the first chip and including circuits for driving the first chip. The first chip includes a first substrate, a device isolation portion disposed in the first substrate and defining unit pixels, an interlayer insulating layer interposed between the first substrate and the second chip, a connection wiring structure disposed in the interlayer insulating layer, and a connection contact plug disposed in the interlayer insulating layer and connecting the connection wiring structure to the device isolation portion in the optical black region. The image sensor further includes a conductive pad disposed in the first chip or the second chip.

公开(公告)号：US20220271077A1

公开(公告)日：2022-08-25

申请号：US17668524

申请日：2022-02-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongchul LEE ,  Jinyoung KIM ,  Beomsuk LEE ,  Kwansik CHO ,  Hochul JI

IPC: H01L27/146

Abstract: An image sensor includes a semiconductor substrate having a first surface and a second surface. The first surface includes an element isolation trench. An element isolation layer is arranged inside the element isolation trench. The element isolation layer defines an active region. A gate electrode is arranged on the first surface of the semiconductor substrate. An interlayer insulating layer is arranged on the first surface of the semiconductor substrate and covers the gate electrode. A ground contact is configured to penetrate the element isolation layer and the interlayer insulating layer and contacts the semiconductor substrate. A color filter is arranged on the second surface of the semiconductor substrate.

公开(公告)号：US20230069205A1

公开(公告)日：2023-03-02

申请号：US17984577

申请日：2022-11-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwansik CHO ,  Shin KIM ,  Jinho LEE ,  Chanyoung PARK ,  Jeasun YOU ,  Jinseol JEONG

IPC: B01D46/00 ,  A47L9/12 ,  B01D46/24 ,  B01D39/16 ,  B29C43/36 ,  B29C43/52

Abstract: A vacuum cleaner comprises: a suction part for suctioning external air; a discharge part through which the sucked air is discharged to the outside; a frame along a flow path between the suction part and the discharge part; and a filter including a filter member which is supported by the frame and which separates dust from the suctioned air, wherein the filter member includes: a first filter part spaced from and to be parallel with an opening formed in the frame; a second filter part having one side supported by the frame and another side extended from the one side thereof toward the edge of the first filter part; and a bent part between the edge of the first filter part and the other side of the second filter part, and the thickness of the first filter part or the second filter part is different from the thickness of the bent part.

公开(公告)号：US20220149101A1

公开(公告)日：2022-05-12

申请号：US17377792

申请日：2021-07-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-Chul LEE ,  Beomsuk LEE ,  Minho JANG ,  Kwansik CHO

IPC: H01L27/146

Abstract: An image sensor includes a first chip including a pixel region, a pad region, and an optical black region interposed between the pixel region and the pad region, and a second chip being in contact with a first surface of the first chip and including circuits for driving the first chip. The first chip includes a first substrate, a device isolation portion disposed in the first substrate and defining unit pixels, an interlayer insulating layer interposed between the first substrate and the second chip, a connection wiring structure disposed in the interlayer insulating layer, and a connection contact plug disposed in the interlayer insulating layer and connecting the connection wiring structure to the device isolation portion in the optical black region. The image sensor further includes a conductive pad disposed in the first chip or the second chip.

公开(公告)号：US20220102398A1

公开(公告)日：2022-03-31

申请号：US17246064

申请日：2021-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jameyung KIM ,  Tae-Hun LEE ,  Dongmo IM ,  Kwansik CHO

IPC: H01L27/146

Abstract: An image sensor includes a substrate, and a pixel separation pattern disposed in the substrate and interposed between a plurality of unit pixels. The plurality of unit pixels include a first unit pixel region and a second unit pixel region adjacent to the first unit pixel region in a first direction. The first unit pixel region and the second unit pixel region respectively include a first transfer gate and a second transfer gate. The pixel separation pattern includes a first pixel separation part interposed between the first unit pixel region and the second unit pixel region, and a second pixel separation part spaced apart from the first pixel separation part in the first direction. A top surface of the first pixel separation part is lower than a top surface of the second pixel separation part.