公开(公告)号：US20230091131A1

公开(公告)日：2023-03-23

申请号：US17739329

申请日：2022-05-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Geunwoo KIM ,  Jiwon SHIN ,  Donguk KWON ,  Wooram MYUNG ,  Kwangbok WOO

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

Abstract: Provided is a mounting substrate for a semiconductor package, including a substrate having an upper surface and a lower surface opposite to each other, the substrate including a plurality of insulation layers and wirings in the plurality of insulation layers, first substrate pads and second substrate pads on the upper surface in a chip mounting region of the mounting surface, heat absorbing pads on the upper surface in a peripheral region of the mounting surface adjacent to the chip mounting region, and connection lines in the substrate, the connection lines being configured to thermally couple the heat absorbing pads and the second substrate pads to each other.

公开(公告)号：US20220122908A1

公开(公告)日：2022-04-21

申请号：US17348936

申请日：2021-06-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Donguk KWON ,  Jiwon SHIN ,  Kwangbok WOO ,  Minseung JI

IPC: H01L23/498 ,  H01L23/32 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10

Abstract: A lower semiconductor package of a package-on-package type semiconductor package includes: a package substrate; a semiconductor chip mounted on the package substrate; a chip connecting terminal disposed between the semiconductor chip and the package substrate and configured to connect the semiconductor chip to the package substrate; conductive pillars arranged on the package substrate to at least partially surround the semiconductor chip; and a dam structure configured to cover the conductive pillars on the package substrate and having a first opening at least partially surrounding the semiconductor chip.