Abstract:
A robot blade may include a blade body and a frequency variator. The blade body may include a frequency variation groove. The frequency variator may be detachably arranged in the frequency variation groove to vary a frequency of the blade body. Thus, the robot blade may have a changed shape by removing at least one frequency variation block included in the frequency variator. Therefore, the robot blade having the changed shape may have a frequency different from a frequency of a part in semiconductor fabrication equipment to prevent a resonance. As a result, a vibration of the robot blade may be suppressed to prevent damage to a semiconductor substrate.
Abstract:
Provided is a plasma processing apparatus including a substrate chuck in a chamber, a restriction ring surrounding an outer perimeter of the substrate chuck, a movable ring on the restriction ring, and an actuator configured to move the movable ring, wherein grooves formed in the restriction ring are opened or closed by movement of the movable ring. In addition, provided is a plasma processing method using the plasma processing apparatus.
Abstract:
A video signal processing device may include a signal converter configured to generate a video output signal based on a video input signal and a reference signal, a reference signal generator configured to generate the reference signal. The reference signal may be adjusted to accommodate changes in the video input signal.