公开(公告)号：US20190301016A1

公开(公告)日：2019-10-03

申请号：US16207967

申请日：2018-12-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SHIN-JAE KANG ,  Dong-Hoon HAN ,  Do-Hyung KIM ,  Kyung-Wook PARK ,  Kevin BAE ,  Sun-Soo LEE ,  In-Jae LEE ,  Jeon-II LEE ,  Chae-Mook LIM

IPC: C23C16/455 ,  C23C16/34 ,  H01L21/285 ,  H01L21/768

Abstract: In a layer deposition method, a substrate is loaded into a process chamber. A gas filling tank is charged with a gas to a predetermined charge pressure. The pressure of the gas is elevated to a pressure greater than the predetermined charge pressure. The gas is introduced into the process chamber.