公开(公告)号：US20240365059A1

公开(公告)日：2024-10-31

申请号：US18738773

申请日：2024-06-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kangwook Byun ,  Ungki Min ,  Seunghwan Lee ,  Jongdoo Kim ,  Youji Lee ,  Jaesun Lee ,  Gun Lim

IPC: H04R3/00 ,  H04R9/04

CPC classification number: H04R3/00 ,  H04R9/045 ,  H04R2420/05 ,  H04R2499/11

Abstract: An electronic device includes: a housing; a first speaker in the housing; and a printed circuit board in the housing and surrounding at least a portion of the first speaker, wherein the first speaker includes: a coil area in which a coil for an operation of the first speaker is disposed; a flexible board on an outer portion of the coil area and including a wire surrounding at least a portion of the coil area; and a connection terminal at one end of the flexible board and electrically connected to the printed circuit board.