公开(公告)号：US20190157217A1

公开(公告)日：2019-05-23

申请号：US16197957

申请日：2018-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung-won KIM ,  Jun-won HAN ,  Yeon-woo KIM ,  Hye-yun PARK ,  Cheol-sang YOON ,  Kangtaek LEE ,  Hyungjoon JEON ,  Young-Geon SONG

IPC: H01L23/00 ,  H01L23/373 ,  H01L21/02

Abstract: A hybrid composite film, a method of fabricating the hybrid composite film, and an integrated circuit device including the hybrid composite film, the hybrid composite film including a polymer film; and a plurality of organic-inorganic composite particles dispersed in the polymer film, wherein each particle of the plurality of organic-inorganic composite particles includes an inorganic particle and an organic capping layer surrounding the inorganic particle, the organic capping layer having a hydroxyl group-terminated end.