公开(公告)号：US20180068958A1

公开(公告)日：2018-03-08

申请号：US15495051

申请日：2017-04-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： KYONGSOON CHO ,  MYOUNGKYUN KIL ,  HANSUNG RYU

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/48 ,  H01L25/00

CPC classification number: H01L23/562 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/181 ,  H01L2924/00012

Abstract: Disclosed are a semiconductor package and a method of fabricating the same. The semiconductor package includes a first substrate, and a first semiconductor chip positioned above the first substrate. A second semiconductor chip is positioned above a top surface of the first semiconductor chip. An adhesive layer is between the first semiconductor chip and the second semiconductor chip. A second substrate is disposed on the second semiconductor chip. The second substrate substantially covers a top surface of the second semiconductor chip. A mold layer is disposed between the first substrate and the second substrate.

公开(公告)号：US20240006434A1

公开(公告)日：2024-01-04

申请号：US18338933

申请日：2023-06-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： KYONGSOON CHO

IPC: H01L27/146 ,  H01L25/16 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L27/14618 ,  H01L25/167 ,  H01L24/48 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/73 ,  H01L24/17 ,  H01L27/14636 ,  H01L2224/48227 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/73207 ,  H01L2224/17181

Abstract: An image sensor package includes a package substrate, a logic chip mounted on the package substrate and having a central region and an edge region, an image sensor chip mounted on the central region of the logic chip, a bonding wire electrically interconnecting the package substrate to the logic chip and bonded to the edge region of the logic chip, a dam structure disposed in the edge region of the logic chip to cover a portion of the bonding wire, a cover glass disposed on the dam structure, and an encapsulation structure encapsulating the bonding wire on the package substrate.