公开(公告)号：US20230028943A1

公开(公告)日：2023-01-26

申请号：US17680877

申请日：2022-02-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HYUNGGYUN NOH ,  SANGWOO PAE ,  JINSOO BAE ,  ILJOO CHOI ,  DEOKSEON CHOI ,  KEUNHO RHEW

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package includes; a package substrate including an upper surface with a bonding pad, a lower semiconductor chip disposed on the upper surface of the package substrate, wherein an upper surface of the lower semiconductor chip includes a connect edge region including a connection pad and an open edge region including a dam structure including dummy bumps, a bonding wire having a first height above the upper surface of the lower semiconductor chip and connecting the bonding pad and the connection pad, an upper semiconductor chip disposed on the upper surface of the lower semiconductor chip using an inter-chip bonding layer, and a molding portion on the package substrate and substantially surrounding the lower semiconductor chip and the upper semiconductor chip.