公开(公告)号：US20240353442A1

公开(公告)日：2024-10-24

申请号：US18643294

申请日：2024-04-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Moonil Kim ,  Kyoungmin Lee ,  Junnyeong Cho

IPC: G01R1/04 ,  G01R1/067

CPC classification number: G01R1/045 ,  G01R1/0466 ,  G01R1/06722

Abstract: Provided are a probe card and a semiconductor device inspection system including the same. A probe card includes a socket structure including at least one socket, and a plane structure located on the socket structure. The at least one socket includes at least one RF signal pin through which a signal of a radio frequency (RF) band is transmitted, and at least one ground pin. The plane structure includes an RF plane including at least one RF signal line electrically connected to the at least one RF signal pin, and a ground plane electrically connected to the at least one ground pin, the ground plane being located between the RF plane and the socket structure.