公开(公告)号：US20180229343A1

公开(公告)日：2018-08-16

申请号：US15679355

申请日：2017-08-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ho-joong KIM ,  Jun-yong KIM ,  Tae-sung KIM ,  Seok-jun HONG

IPC: B24B37/005 ,  B24B53/017 ,  G01B21/30 ,  H01L21/67 ,  H01L21/687

CPC classification number: B24B37/005 ,  B24B53/017 ,  G01B11/303 ,  G01B21/30 ,  H01L21/30625 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/68714 ,  H01L22/20

Abstract: A chemical mechanical polishing (CMP) device includes a rotatable CMP pad located on a polishing platen, a rotatable wafer carrier located on an upper portion of the CMP pad and including a wafer, and a surface-roughness measuring device which is located apart from a surface of the CMP pad in a vertical direction and measures surface roughness of the CMP pad, wherein the surface-roughness measuring device includes a sensor array having a plurality of sensors, and the sensor array is horizontally movable over the upper portion of the CMP pad.