公开(公告)号：US20140242782A1

公开(公告)日：2014-08-28

申请号：US14077956

申请日：2013-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun-hyoung CHO ,  Jun-Hee CHOI ,  Jin-seung SOHN ,  Chang-youl MOON

IPC: H01L21/78 ,  H01L21/82 ,  H01L21/02 ,  H01L21/28

CPC classification number: H01L21/7806 ,  H01L21/02343 ,  H01L21/28 ,  H01L21/82 ,  H01L23/3192 ,  H01L27/153 ,  H01L31/035281 ,  H01L31/03926 ,  H01L31/1848 ,  H01L31/1856 ,  H01L31/1892 ,  H01L31/1896 ,  H01L33/0079 ,  H01L33/02 ,  H01L33/32 ,  H01L33/44 ,  H01L2933/0016 ,  H01S5/0217 ,  H01S5/32341 ,  Y02E10/544 ,  Y02P70/521

Abstract: The present disclosure relates to a method of transferring semiconductor elements from a non-flexible substrate to a flexible substrate. The present disclosure also relates to a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. The semiconductor elements grown or formed on a non-flexible substrate may be effectively transferred to a resin layer while maintaining an arrangement of the semiconductor elements. The resin layer may function as a flexible substrate for supporting the vertical semiconductor elements.

Abstract translation: 本公开涉及将半导体元件从非柔性基板转移到柔性基板的方法。 本公开还涉及一种基于传送半导体元件的方法制造柔性半导体器件的方法。 在非柔性基板上生长或形成的半导体元件可以有效地转移到树脂层，同时保持半导体元件的布置。 树脂层可以用作用于支撑垂直半导体元件的柔性基板。