公开(公告)号：US10535575B2

公开(公告)日：2020-01-14

申请号：US15997131

申请日：2018-06-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shaofeng Ding ,  Kyoung-woo Lee ,  In-hwan Kim ,  Jong-woon Lee

IPC: H01L21/768 ,  H01L21/66 ,  H01L23/498 ,  H01L25/065

Abstract: An interposer includes a substrate having a mounting area and a test area, first conductive plugs separate from each other, the first conductive plugs being disposed along a first direction and into the test area of the substrate, a first line pattern group including first non-conductive patterns disposed on first centers of the first conductive plugs, and first conductive patterns disposed to bridge first peripheries of a first adjacent pair of the first conductive plugs, and first pads connected to the first conductive patterns at both first ends of the first line pattern group.