公开(公告)号：US20220215034A1

公开(公告)日：2022-07-07

申请号：US17495273

申请日：2021-10-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kangyong PARK ,  Seungho JUNG ,  Minhyeok KWEUN ,  Kyungjae KIM ,  Goeun KIM ,  Eunkyu OH ,  Hyun HEO ,  Jisoo HWANG

IPC: G06F16/25 ,  G06N5/02

Abstract: An electronic apparatus is provided. The electronic apparatus includes a storage and a processor to generate first training data by performing transformation for first original data based on at least one first transform function input according to a user input, store first metadata including the at least one first transform function in the storage, generate second training data by performing transformation for second original data based on at least one first transform function included in the stored first metadata, generate third training data by performing transformation for the second training data based on at least one second transform function input according to a user input, and store second metadata including the at least one first transform function and the at least one second transform function in the storage.

公开(公告)号：US20220361339A1

公开(公告)日：2022-11-10

申请号：US17591734

申请日：2022-02-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junghwa KIM ,  Junso PAK ,  Heeseok LEE ,  Moonseob JEONG ,  Jisoo HWANG

IPC: H05K1/18 ,  H01L23/00 ,  H01L23/498 ,  H05K1/02

Abstract: A semiconductor package including a circuit board including a first wiring region, a die mounting region surrounding the first wiring region, and a second wiring region surrounding the die mounting region; a plurality of wiring balls on the first wiring region and the second wiring region and spaced apart from one another, the plurality of wiring balls including a plurality of first wiring balls on the first wiring region and a plurality of second wiring balls on the second wiring region; a die on the die mounting region, the die including a plurality of unit chips spaced apart from one another, and a die-through region corresponding to the first wiring region and exposing the first wiring balls; and a plurality of die balls on the die and the die mounting region, the plurality of die balls being spaced apart from one another and electrically coupled to the circuit board.