公开(公告)号：US20150340172A1

公开(公告)日：2015-11-26

申请号：US14717534

申请日：2015-05-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyo Rang KANG ,  Jeong Hyeon KIM ,  Ji Mam KIM ,  Chan Ho PAK

IPC: H01G11/42 ,  C02F1/469 ,  H01G11/86

CPC classification number: H01G11/42 ,  C02F1/4691 ,  C02F2001/46133 ,  C02F2001/46161 ,  C02F2103/002 ,  C02F2201/46 ,  H01G11/30 ,  H01G11/86 ,  Y02E60/13

Abstract: A mesoporous carbon composite material includes mesoporous carbon, metal nanoparticles distributed on the mesoporous carbon, and phosphorus on the mesoporous carbon. An electronic device includes an electrode including the mesoporous carbon composite material. A method of producing a mesoporous carbon composite metal includes impregnating mesoporous silica with a carbon precursor solution, forming a carbon silica composite by heat-treating the mesoporous silica impregnated with the carbon precursor solution, and removing silica from the carbon silica composite. The carbon precursor solution includes a phosphorous-containing carbon precursor, a metal-containing salt, a solvent, and optionally a carbonization catalyst.

Abstract translation: 介孔碳复合材料包括介孔碳，分布在介孔碳上的金属纳米颗粒和介孔碳上的磷。 电子器件包括包含介孔碳复合材料的电极。 中孔碳复合金属的制造方法包括用碳前体溶液浸渍介孔二氧化硅，通过对浸渍有碳前体溶液的介孔二氧化硅进行热处理，从碳硅复合材料中除去二氧化硅，形成碳硅复合物。 碳前体溶液包括含磷的碳前体，含金属的盐，溶剂和任选的碳化催化剂。