公开(公告)号：US20190258065A1

公开(公告)日：2019-08-22

申请号：US16279056

申请日：2019-02-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sukjin Yun ,  Seunghoon Kang ,  Kyeongsoo Kim ,  Jaecheon Kim ,  Hongki Moon ,  Yoonsun Park ,  Hyunjin Bai ,  Jaewook Jeong ,  Seungbo Hong ,  Jiseong Hwang

IPC: G02B27/01

Abstract: According to various embodiments, an electronic device includes: a housing including: a first plate; a second plate facing a direction opposite a direction of the first plate; and a sidewall surrounding a first space between the first plate and the second plate, the first space being a sealed space; and at least one electronic component arranged in the first space of the housing, wherein at least a part of the sidewall of the housing includes a moisture induction portion configured to induce moisture in the first space to be generated in a moisture induction region of the moisture induction portion that may be due, for example, to a difference in temperature between the first space and an external environment.

公开(公告)号：US10775631B2

公开(公告)日：2020-09-15

申请号：US16279056

申请日：2019-02-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sukjin Yun ,  Seunghoon Kang ,  Kyeongsoo Kim ,  Jaecheon Kim ,  Hongki Moon ,  Yoonsun Park ,  Hyunjin Bai ,  Jaewook Jeong ,  Seungbo Hong ,  Jiseong Hwang

IPC: G02B27/01 ,  G02B27/00 ,  G06F1/18

Abstract: According to various embodiments, an electronic device includes: a housing including: a first plate; a second plate facing a direction opposite a direction of the first plate; and a sidewall surrounding a first space between the first plate and the second plate, the first space being a sealed space; and at least one electronic component arranged in the first space of the housing, wherein at least a part of the sidewall of the housing includes a moisture induction portion configured to induce moisture in the first space to be generated in a moisture induction region of the moisture induction portion that may be due, for example, to a difference in temperature between the first space and an external environment.

公开(公告)号：US20230402439A1

公开(公告)日：2023-12-14

申请号：US17985332

申请日：2022-11-11

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  CHUNGBUK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION

Inventor： Kyungwook Hwang ,  Jaewook Jeong ,  Junsik Hwang ,  Dongkyun Kim ,  Dongho Kim ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong ,  Sanghoon Song ,  Minchul Yu

IPC: H01L25/16 ,  H01L33/38 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01L33/38 ,  H01L24/05 ,  H01L24/95 ,  H01L2224/05559 ,  H01L24/16 ,  H01L2224/16145 ,  H01L2224/95001

Abstract: Provided is a microchip including a chip body having a first surface and a second surface facing the first surface, and an electrode layer on the second surface, wherein a surface roughness of the first surface is smaller than a surface roughness of an upper surface of the electrode layer such that van der Waals force between the first surface and an external contact surface are greater than van der Waals force between the electrode layer and the external contact surface.